MG Chemicals 8331D Silver Conductive Epoxy Adhesive, High Conductivity, 20 min Working time, 2-Part, 14 Gram Kit

Silver Conductive Epoxy Adhesive 8331D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331D has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, time, use 8331S. Application Instructions: Read the product SDS and Application Guide for more detailed instructions before using this product (downloadable from MG Chemicals). Recommended Preparation: Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues. Syringe 1. Twist and remove the cap from the syringe. Do not discard cap. 2. Measure 1 part by volume of A. 3. Measure 1 part by volume of B. 4. Dispense material on a mixing surface or container, and thoroughly mix parts A and B together. 5. To stop the flow, pull back on the plunger. 6. Clean nozzle to prevent contamination and material buildup. 7. Replace the cap on the syringe. Cure Instructions: Allow to cure at room temperature for 6 hours, or cure the adhesive in an oven at one of these time/temperature options: 10 min @ 65 ˚C 5 min @ 80 ˚C Storage and Handling: Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use.

• Creates strong permanent electrical connections
• Electrical resistivity: 1.8 x 10-3 Ω·cm, Thermal conductivity: 1.5 W/(m·K).
• Use as a solder replacement or for bonding heat-sensitive electronic components. Cures at room temperature but heat cure is recommended to get the best possible conductivity
• Excellent adhesion to many substrates such as glass, soft metals and plastics
• SVHC free